FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Brand VISHAY Part Number PHP01206E2001BST3

Brand VISHAY Part Number PHP01206E2001BST3 Quantity Each (Supplied on Cut Tape) Technical Data Sheet EN

Surface Mount product from COILCRAFT with the model number CU8965-ALDProduct details

Powers from P-Tap/D-Tap

Wire Size AWG Max 14AWG Wire Connection Method Clamp Rated Current 18A No

Variable color temperature from 3

FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Brand VISHAY Part Number PHP01206E2001BST3The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1. 8mm Plate thickness Applications Industrial Product details External Diameter Metric Packages Cooled BGA, PLCC Heat Sink Material Aluminium Thermal Resistance 23C W External Length